Cu on Al2O3 & AlN

F. S. Ohuchi, R. H. French, R. V. Kasowski, "Cu Deposition on Alumina and Aluminum Nitride Surfaces: Electronic Structure and Bonding", Journal of Applied Physics, 62, 6, 2286-89 (1987).

F. S. Ohuchi, R. H. French, R. V. Kasowski, "A Study of Room Temperature Cu-Al₂O₃ and Cu-AlN Interfacial Interactions", J. Vac. Sci. Technol. A, 5, 4, 1175-7 (1987).

R. V. Kasowski, F. S. Ohuchi and R. H. French, "Theoretical and Experimental Studies of Cu Metallization of Al₂O₃", Physica B, 150, 1-2, 44-46 (1988).

F. S. Ohuchi, R. H. French, "Effect of Oxygen Incorporation in AlN Thin Films", J. Vac. Sci. Technol. A, 6, 3, 1695-6 (1988).

Copper Deposition on Alumina and Aluminum Nitride Surfaces: Electronic Structure and Bonding

F. S. Ohuchi, R. H. French, R. V. Kasowski

We report a photoelectron spectroscopy study of the interaction of copper with Al2O3 and AlN model systems processed under ultrahigh vacuum conditions and compared the intrinsic electronic interactions between the two cases. The evolution of the electronic structure and bonding of Cu to AlN has been further studied using ab initio total energy pseudofunction techniques.