Photoresist
OP&ES Home Up Phase Shift Photomasks Pellicles Photoresist Photomask Substrates

 

 

A. E. Feiring, J. Feldman, F. L. Schadt III, K. W. Leffew, F. C. Zumsteg, M. K. Crawford, R. H. French. R. C. Wheland, V. A. Petrov, W. B. Farnham, “Design of Very Transparent Fluoropolymer Resists for Semiconductor Manufacture at 157 nm” Journal of Fluorine Chemistry, 122, 11-16, (2003).

 M. K. Crawford, W. B. Farnham, A. E. Feiring, J. Feldman, R. H. French, K. W. Leffew, V. A. Petrov, W. Qiu, F. L. Schadt III, H.V. Tran, R. C. Wheland, F. C. Zumsteg, “Single Layer Fluoropolymer Resists for 157 nm Lithography”, Advances in Resist Technology and Processing XVIII , SPIE Vol. 5039, (2003).    


 Roger H. French, Jerald Feldman, Fredrick C. Zumsteg, Michael K. Crawford, Andrew E. Feiring, Joseph Gordon, Viacheslav A. Petrov, Frank L. Schadt III, Robert C. Wheland, Edward Zhang, “Progress in Materials Development for 157nm Photolithography: Photoresists and Pellicles”, Semiconductor Fabtech,  ICG Publishing Ltd., London, Edition 14, 167-75, July 2001.

Michael K. Crawford, Andrew E. Feiring, Jerald Feldman, Roger H. French, Viacheslav A. Petrov, Frank L. Schadt III, Robert J. Smalley, Fredrick C. Zumsteg, “157 nm Imaging Using Thick Single Layer Resists”, Advances in Resist Technology and Processing XVIII , SPIE Vol. 4345, (2001). 

M. K. Crawford, A. E. Feiring, J. Feldman, R. H. French, M. Periyasamy, F. L. Schadt III, R. J. Smalley, F. C. Zumsteg, R. R. Kunz, V. Rao, L. Liao, S. M. Holl, “New Materials for 157 nm Photoresists: Characterization and Properties”, Advances in Resist Technology and Processing XVII, SPIE Vol. 3999, edited by F. M. Houlihan (2000).  

 

Comment: (c) 2010 Roger H. French , frenchrh@lrsm.upenn.edu
All Rights Reserved, See Appropriate Use Page